Tags » Microelectronics
The following are great reference materials for process engineers and packaging engineers:
- Fundamentals of Microsystems Packaging by Rao R. Tummala – This book provides a thorough, comprehensive view of microelectronics packaging. 190 more words
Global Semiconductor microelectronics material Market 2016 Industry Trends, Sales, Supply, Demand, Analysis & Forecast to 2021
The Global Semiconductor microelectronics material Industry report gives a comprehensive account of the Global Semiconductor microelectronics material market. Details such as the size, key players, segmentation, SWOT analysis, most influential trends, and business environment of the market are mentioned in this report. 68 more words
Naval Surface Warfare Center, Crane Division (NSWC Crane) Chief Engineer for Trusted Microelectronics Brett Hamilton was issued a patent on Jan. 26 for an invention developed to help the Department of Defense (DoD) identify counterfeit microelectronic parts. 265 more words
Microelectronics assembly refers to a microelectronics device or the processes related to packaging that device.
Typical processes associated with wire bondable die packaged onto a substrate or printed circuit board include: component attach, die attach, wire bonding, sealing or encapsulation. 25 more words